Subjgrp 176. Eligible Security Instruments
- § 232.525 - Note and security form.
- § 232.530 - Disbursement of proceeds.
- § 232.535 - Loan multiples—minimum principal.
- § 232.540 - Method of loan payment and amortization period.
- § 232.545 - Covenant against liens.
- § 232.550 - Accumulation of next premium.
- § 232.555 - Security instrument and lien.
- § 232.560 - Interest rate.
- § 232.565 - Maximum loan amount.
- § 232.570 - Endorsement of credit instrument.
- § 232.580 - Application of payments.
- § 232.585 - Prepayment privilege and prepayment charge.
- § 232.586 - Minimum principal loan amount.