Part 413. PART 413—ELECTROPLATING POINT SOURCE CATEGORY

• SUBPART A [§ 413.10 - § 413.14] - Subpart A—Electroplating of Common Metals Subcategory
• SUBPART B [§ 413.20 - § 413.24] - Subpart B—Electroplating of Precious Metals Subcategory
• SUBPART C - Subpart C—Electroplating of Speciality Metals Subcategory [Reserved]
• SUBPART D [§ 413.40 - § 413.44] - Subpart D—Anodizing Subcategory
• SUBPART E [§ 413.50 - § 413.54] - Subpart E—Coatings Subcategory
• SUBPART F [§ 413.60 - § 413.64] - Subpart F—Chemical Etching and Milling Subcategory
• SUBPART G [§ 413.70 - § 413.74] - Subpart G—Electroless Plating Subcategory
• SUBPART H [§ 413.80 - § 413.84] - Subpart H—Printed Circuit Board Subcategory

• General Provisions

  • SECTION § 413.01 - Applicability and compliance dates.
  • SECTION § 413.02 - General definitions.
  • SECTION § 413.03 - Monitoring requirements.
  • SECTION § 413.04 - Standards for integrated facilities.